Abstract:
Embedded capacitance has long been used as a tool in the design of high-layer count printed circuit boards. It is
a means toward providing a capacitive layer and reducing EMI, impedance and the need for discrete capacitors.
Embedded passives will become increasingly important with the advent of wearable technologies and growth
embedded systems. Manufacturing thin (less than 25 micron) reinforced capacitive cores has proven to be
elusive and film-based solutions present a host of problems such as mismatched expansion coefficients leading
to delamination, dimensional instability and inconsistency. The paper introduces a breakthrough technology that
enables the production of 25 micron or less dielectric (capacitive) spacings. Comparison data, with respect to
incumbent technologies, illustrates the benefits of this technology. Data on thermal reliability improvements and
signal integrity is also discussed.