Abstract
The increase in board density, decrease in spacing between holes and features and the increased requirements for printed circuit boards to perform in high temperature/high humidity environments have led to increased concern on the growth of conductive anodic filaments (CAF). There has been a lack of information for standardized testing and failure analysis of various prepregs and laminates.
This paper will discuss a standard test vehicle design and test method, failure analysis and board manufacturing. It
will also include the requirements for CAF resistance. There will be a discussion on material benchmarking and some preliminary results from the testing. These methods will be applicable to all market segments, including high density interconnect and automotive applications.